15 Nov

Electronics Packaging Design Analysis Engineer Jobs Vacancy in Boeing Bengaluru

Position
Electronics Packaging Design Analysis Engineer
Company
Boeing
Location
Bengaluru KA
Opening
15 Nov, 2018 30+ days ago

Boeing Bengaluru urgently required following position for Electronics Packaging Design Analysis Engineer. Please read this job advertisement carefully before apply. There are some qualifications, experience and skills requirement that the employers require. Does your career history fit these requirements? Ensure you understand the role you are applying for and that it is suited to your skills and qualifications.

Follow the online directions, complete all the necessary fields, and provide all relevant information so your application is submitted correctly. When you click the 'Apply this Job' button (open in new window) you will be taken to the online application form. Here you will be asked to provide personal and contact details, respond to employment-related questions, and show how you meet the key selection criteria.

Electronics Packaging Design Analysis Engineer Jobs Vacancy in Boeing Bengaluru Jobs Details:

:

The Boeing India Engineering and Technology Center (BIETC) is looking for an Electronics Packaging Design & Analysis Engineer for a key role in development of a growing business unit. The position will be a hands on technical role with responsibility ranging from printed circuit board, chassis, thermal, structural, fatigue and materials to requirements development, detailed design, documentation and analysis. The successful candidate should have a track record of demonstrated successes from previous work assignments

Responsibilities include:
  • Executing projects independently without supervision
  • Working on Electronic Line Replaceable Unit design & development
  • Analyzing Customer & System Requirements to develop basic mechanical and printed circuit design approach of power supplies and control units
  • Validating designs through thermal and dynamic analyses and testing
  • Identifying and tracking technical performance metrics to measure progress and ensure compliance with requirements
  • Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers
  • Providing guidance and mentoring team during project execution
  • Executing end-to-end project management, including some configuration management and change control
Desired Skills:
  • Must understand the complete product development lifecycle and provide technical guidance and decisions.
  • Experience in detailed development and COTS selection of power and analog/control electronic printed circuit boards, modules, chassis and mechanical fasteners.
  • Experience in requirements capture and validation, schematic capture, printed circuit board (PCB) layout, and electrical interconnect design.
  • Experience with static and dynamic structural analysis, solder joint / lead fatigue analysis, thermal analysis (conduction, radiation, and natural and forced air convection) and mechanical tolerance analysis.
  • Experience with high reliability electronic component selection and design for reliability.
  • Experience with magnetics (transformer, inductor) design.
  • Understanding of configuration management, requirements traceability (DOORS) and related processes.
  • Experience in Aerospace Manufacturing processes
  • Experience in Aerospace - DO-160 and MIL-STD-810 is required. Experience in DO-254 & DO-178 is an added advantage.
  • Strong technical team leadership and mentoring skills. Ability to coordinate multi-discipline team.
  • Project management experience is required. Strong technical writing and verbal communication skills.
  • Experience in using Engineering design tools, specifically Mentor Graphics Xpedition, 3D CAD tools and mechanical Multi-Physics FEA analyses software
  • Mechanical Engineering degree and 14+ years of related work experience, a Master's degree and 12+ years' related work experience or an equivalent combination of education and experience.

All information provided will be checked and may be verified. This requisition is for an international, locally hired position. Candidates must be legally authorized to work in India. Boeing will not seek immigration and labor sponsorship for any applicants; this is the responsibility of the job candidate. Benefits and pay are determined at the local level and are not part of Boeing U.S.-based payroll. RELOCATION BENEFITS IF INDICATED ARE LIMITED TO IN-COUNTRY MOVES AND ARE NOT AVAILABLE FOR OVERSEAS RELOCATION. THERE IS NO EXPATRIATE PACKAGE ASSOCIATED WITH THIS POSITION.
Yes, 10 % of the Time Engineering Core Individual Contributor No No Standard India; Boeing India Private Limited


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